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At this half year, the Intel’s core i7 is the key promoted product of the high-end product line. The users are really easy to run out their budget while the CPU is still not cheap at all…. But the pricing of X58 motherboard is a bit “flexible” than the CPU’s. So, some of the manufactures have already launch their entre-level X58 mobos. The price of them are around USD200 ~ 200. It’s much cheaper that compares to the highest-end models. Recently, Intel is going to launch their Core i5 (LGA1156) processor. It’s around the corner. For the different segment of the market, Intel will place Core i3, Core i5 & the Core i7 as the value, mid-range and high-end product. After the launch of Flaming Blade, FOXCONN releases a step-lower model, called Flaming Blade GTI version. The price is around USD183. First, take a look at the package design. Although it should be a value X58 board, but FOXCON still make it as a high-end product design. Looks like a high-end product. A big box package and some details in the back for the spec too. FOXCONN Flaming Blade GTI, the board. In this market segment, the ordinary capacitors are the reasonable choice. The bundling: User Manual, Easy guide, Drivers and Utility CD, IO shield….etc. The lower-left part: 2 X PCI-E X16 slots (supports2 X 16X?ATI CrossFireX) 1 X PCI-E X4 slot 2 X PCI slots The LAN chip: Realtek RTL8111C The audio codec: Realtek ALC888?supports 7.1 channels HD audio. The lower right part: 6 X SATAII (ICH10) 1 X IDE The debug light The upper right part: 3-channel DDR3, support 1333/ 1600/ 1800, max support up to 12G The left plug is the 24pin power input. The upper left This is LGA1366 socket, but Foxconn keep the 775 cooler’s mount hole. A real smart design for users The CPU power supply parts, the board put 6-phase PWM on. I think it’s enough for i7 normal usage.

The lacquered quality of heat pipe is great, with amazing design of finned plates and cooler area. LGA 1156 platform is becoming available in the market in less two months. According to more and more news from the Internet, Intel is going to categorise its products into three kinds of platforms— LGA 775, i3/i5/i7(LGA 1156), i5/i9(LGA 1366). As customers, they may think there are too many product series and different sockets; hence, they easily feel confused and do not know how to choose. All in all, the launch of new products can renew the old product series faster. Since LGA 1366 is deemed as high-level products, it is inadequate for LGA775 for non high-level products. So, the coming of LGA 1156 can make Intel platforms more complete, and customers, depending upon their budget, therefore have more choices. Let’s look forward to waiting MB manufacturers’ products, and price of Intel LGA 1156 CPU.

With the coming of September, the latest Intel LGA 1156 platform of high-intermediate level is also coming. On this platform, Intel recently added the support of Core i7 processor, so in future both Core i5 and Core i7 processors can be used, the successful development that can improve the efficiency more effectively. At present, the sale of LGA 1156 platform is not available before September, but, despite of the fact that the economic is still depressed, there have been a lot of MB manufacturers planning promotion for more attractive products based on this new platform. Currently, the price of X58 is at US$ 200~300; the price of P55 motherboard of LGA 1156 is expected to be sold at about US$ 100~300; and the price of most products of P55, at about US$ 120~200, the same product level as P35 and P45 before. Why is the price of P55 as almost high as that of X58? Actually, X58 is deemed as a high level product; P55, higher than intermediate level and lower than high one. Therefore, the price of P55 and of X58 is nearly the same; as for X58, for several months there have been many product series based on this chipset, and they are priced at about US$ 200. At first, the price of P55 should be probably the same as that of P45, with intermediate level at US$ 150~200, or with high level at nearly US$ 300. We are going to introduce BIOSTAR P55 product, the highest level version, the price of which is at about US$ 200. The most important feature of BIOSTAR products is easy to overclock, and supplies at reasonable prices. The price of highest-level P55 is the same as that of elementary-level X58. Full view of BIOSTAR TPOWER I55 BIOSTAR’s design and material are much better than ever. It is also one of the best MB manufacturers. My favourite blue and big heat pipe make the quality excellent. Down-left of the motherboard 2 X PCIE X16(support ATI CrossFireX and Nvidia SLI technology? X8+X8 bandwidth) 1 X PCI-E X4 2 X PCI-E X1 2 X PCI Dual LAN Intel 82578/Realtek RTL8111DL, support 2Gb LAN Teaming For multi VGAs, X series chipset uses X16+X16 bandwidth, but P series chipset, limited X8+X8 bandwidth. Down-right of the motherboard 6 X SATAII(ICH10R?support Raid0?1?5) Power/Reset button and debug LEDs 1394a uses LSI chipset Up-right of the motherboard 4 X DIMM DDR3?support 800/1066/1333/1600/2000+ 1 X IDE 24PIN power input?DDR3 uses 2phase Power supply uses 8 phase CPU Power?4 phase CPU NB IO 8 X USB 2.0 2 X eSATA 2 X Gigabit LAN 1 X 1394a Although north and south bridge are combined in P55, BIOSTAR still add a big heat sink on the traditional north bridge location, the design that makes not only the appearance more attractive, but also cooler area bigger. Picture of LGA 1156 with Core i7 870

North bridge function is integrated on CPU. The function of P55 chipset is only South bridge. The MSI heatsink on P55 chipset looks quite nice. There’s MSI OC Genie controlling chip on the left. OC Genie is spontaneous overclocking chip. Users only press the bottom to overclock very conveniently. Black +/- button named Direct OC, used for switching CPU Base Clock directly as well as instant hardware overclocking. MSI named the heatpipe Superpipe this time. Heat transferring with 8mm thickness Superpipe is supposely better than traditional heatpipe, of which the fact needs to be confirmed by testing. I perceived that in recent X58 and P55 chipsets, mainboard are more and more user-friendly on material and design. Every manufacturer desires to present new technology, new material, or new function to reinforce competitiveness of its brand as well as animating the market. Web news says that CPU on socket 1156 will hit retail market after September. Every main motherboard players are so hot to trot for P55 product launch. Hopefully, new platform with socket 1156 for middle-to- high end market is ideal for those who look for high C/P products.

Core i7, new CPU platform, featured as socket 1366, was launched by Intel last year. Nevertheless based on this structure, it has been positioned as high-end product until now and even in the future. During this period, market demand below high-end served by socket 775 old structure needs to be fulfilled as well. There’s a rumor saying socket 1156, applicable for CPU marked as Core i5 will replace those between high and middle end. However, recently the classification of product line has slightly changed. Socket 1366 remains the high-end platform. Besides Core i7, another platform featured as 6 cores, 12MB cache, will be launched. They call it- i9 Regarding socket 1156, no only Core i5 but also Core i7 supports 1156 pins meaning users have to distinguish by LGA 1366 or LGA 1156 instead of Core i5 or Core i7. Back to our spotlight, MSI P55-GD65, socket 1156 mainboard, is not ranked as MSI’s highest-end by telling from its Marketing name. Panorama of MSI P55-GD65 Bottom Left 2X PCIEX16(Supports ATI CrossfireX and Nvidia SLI Technology, bandwidth X8+X8) 1 X PCI-E X4 2 X PCI-E X1 2 X PCI The same market position as former product line. X series chipsets have X16+X16 bandwidth with multi-VGA while P series are still limited with X8+X8 bandwidth. Bottom Right 7 X SATAII 1 X IDE Top Right 4 X DIMM DDR3 1 X Floppy 24-pin Power Input Blue area is V-Check points, for users who need to measure system voltage by ammeter which indicate CPU Vcore/CPU VTT/DDR VCC/PCH. Top Left 6+1 phrase CPU Power supply, support Dr.MOS Technology. IO What socket 1156 differs from 1366 is that it doesn’t have DDR3 trial channels and QPI Technology. P55 platform principally has DDR3 dual channels. Although the performance is behind X58 trial channel structure, P55’s support range is enhanced to DDR3-1333. Hook’s slightly different from other socket platforms.

PCMark Vantage 14172 Hyper 8 X PI 32M 13m 04.635s CPUMARK 99 659 196 X 23=>4510Mhz Hyper 4 X PI 8M 1m 46.845s CPUMARK 99 707 The OC potential of Core i7 is better than Core 2. I overclocked it to 4150MHz on JR X58 with air cooling only. PI 8M? Pass! CPUMARK? More than 700 score! DFI LANParty shows us a principle, “microATX can perform as well as ATX motherboard”. About 3D (Based on Gigabyte GTX 260 OC SLI) You can find GTX 260 performance in Core i7 platform (In my another X58 review, 4870X2, 4870, 4850, 4650, 9600GT have been tested) 3DMARK2006 25816 3DMARK VANTAGE 19404 Crysis Benchmark THE LAST REMNANT StreetFighter IV Benchmark 1680 X 1050 21738 1920 X 1200 18638 microATX motherboard with SLI technology ready is very hard to find in retail. With GTX 260 SLI & LANParty JR X58, it’s easy to conquer most games you can find. Conclusion of DFI LANParty JR X58-T3H6 Positive 1. The first microATX board in LGA 1366 architecture. 2. The best quality and quantity in material such as capacitor & resistor. 3. All made in Japan capacitors/ Debug LED/ on-board POWER/ RESET buttons. 4. Supports both SLI & CrossFireX 5. Embedded with many OC BIOS setting/ wide range of voltage setting, performs as well as other hi-end X58 from competitors. Negative 1. No 1394 & eSATA in rear I/O 2. Hard to find in Taiwan retail market Performance ?????????? Materials ?????????? Appearance ?????????? Cost/ Performance ?????????? DFI LANParty bust the myth about “small motherboard cannot overclock and always perform worst than ATX one”. In the small but powerful product, DFI adopt the best material & BIOS options, no wonder it shows the astonishing performance. To compare with other ATX products, LANParty JR X58 can also beat most of them. X58 chipset is focusing on hi-end market at this moment, the SRP of JR X58 is around USD 228. If you want to build a small gaming machine, JR X58 is the best choice. JR X58 has been launched in Jan. 2009. Powerful microATX began to be a trend, ASUS, MSI also launched microATX product after April, users can have more choice in this segment now. Of course, after competition, you can buy power microATX with lower price.

PC Health Status JR X58 has as many BIOS option as DK X58. The 200/2000MHz setting is based on the equipment below, if you have the same components, you can try the setting to save time. Testing platform CPU: Intel Core i7 950 MB: DFI LANParty JR X58-T3H6 DRAM: CORSAIR Dominator GT TR3X6G2000C7GT VGA: GIGABYTE GTX260 OC SLI HD: Intel X25-M 80GB SSD POWER: Corsair HX1000W Modular Power Supply Cooler: DFI LANParty Cooler/Lubic About DRAM CORSAIR Dominator GT TR3X6G2000C7GT (DDR3 2000 CL7 8-7-20 1.65V) is the best DDR3 DRAM module in retail market. DDR3 2000 CL7 7-7-20 1T?1.63V(BIOS 1.65V) SP2004 3 X Blend mode?stable in 5.82GB with full loaded. DDR3 2000 CL7 7-7-20 1T Sandra Memory Bandwidth-34511MB/s EVEREST Memory Read-21900MB/s DDR3 2130 CL7 8-7-20 1T?1.76V(BIOS 1.785V) SP2004 3 X Blend mode?stable in 5.81GB with full loaded. DDR3 2130 CL7 8-7-20 1T Sandra Memory Bandwidth-35638MB/s EVEREST Memory Read-21461MB/s DDR3 2170 CL7 8-7-20 1T Sandra Memory Bandwidth-36272MB/s EVEREST Memory Read-22631MB/s Dominator GT performs very well, it can be OC to 2000MHz with CL7 7-7-20. To cooperate with LANParty JR X58, it can be overclocked up to 2130MHZ and work stably (CL7 8-7-20). For the highest result, I OC it to 2170MHz. JR X58 is so amazing in DRAM overclocking, is brings the same performance with LANParty DK X58. CPU Intel Core i7 950 OC 200 X 21 => 4200Mhz DDR3 2000 CL7 7-7-20 1T CrystalMark 2004R3 CINEBENCH R10

About north bridge: 2-phase PWM for VTT The “easy to remove” NB cooler, user can change the cooler without damaging chip as they want. Tri-Channel DDR3 architecture Core i7 is embedded with memory controller; it brings 2 or 3 times higher memory performance. Boot Screen Main page for OC setting. You can enable turbo mode with “non-Extreme version” CPU. CPU Feature DRAM Timing: adjust the top three options for better DRAM performance (The result depends on DRAM quality). Voltage Setting CPU VID Control 1.0000~2.0000V Power Saving (DFI LANParty use different name for it. The function helps to prevent “voltage drop” situation). DRAM Bus Voltage 1.455~2.400V CPU VTT Special Add +0.0125~0.1875V CPU VTT Voltage 1.21~1.61V Please turn off “O.C. Shut Down Free” when overclocking.

From early 2008, there were a new member joined LANParty family, it was “JR series”. The significant difference between JR & DK is form factor; the smaller board brings OC performance as well as other ATX products. The first two models were based on P45 & 790GX chipset. In early 2009, DFI LANParty launched the JR X58, which based on Intel LGA 1366 platform. Rely on Core i7’s performance and LANParty technology, microATX won’t mean “low performance” anymore. Let’s see the package of LANParty JR X58-T3H6, it adopt the same style with JR P45/ JR 790GX. You can only see difference in product name. Accessories: User manual, Driver & utility DVD, ABS manual, cables, I/O shield, bridge for SLI & CrossFireX. DFI LANParty JR X58-T3H6 Bottom left 2 PCIe x16 1 PCIe x4 1 PCI GbE LAN: Marvell 88E8053 Audio Codec: Realtek ALC 889 (7.1 channels HD audio ready) Buttom right 6 X SATAII(ICH10R?RAID 0? RAID 1? RAID 0+1 and RAID 5) On-board POWER/RESET buttons & Debug LED. Upper right 6 X DIMM DDR3?support 1066/1333/1600/1800(OC) DFI is conservative in marking specification. Actually, if you can find good DDR3 module, it’s easy to OC to 2000MHz. Upper left 6-phase digital PWM; each phase PWM provides 30W~40W, it’s quite enough to any Core i7 CPU (according to Intel official information, the TDP of Core i7 965 is 130W). Rear I/O 6 X USB 2.0 1 X Optical S/PDIF-out port 1 X Coaxial RCA S/PDIF-out port 1 X RJ45 LAN port Red jumper for clearing CMOS

501Mhz reached Q8400 OC ability is quite good. The FSB can reach 501MHz. In most multi-core software, Q8400 all gets very high score. Windows7 full mark is 7.9 and Q8400 gets 7.5. E6300/Q8400 are different with pervious products. They all support VT-x technology. It will make Windows7 performance be better. These 2 CPU launched price is only a little bit higher than old products. I think it’s good product transition plan. Hope Intel will keep providing LGA775 CPU. Core 2 Duo is Intel long life cycle product. The hi-end segment is i7. If considering CPU/MB models and price, Core 2 Duo/Core 2 Quad are good choice. As i5 is still unclear, Core 2 Duo platform still your best shoice.

Defalut CPU 333 X 8 => 2666Mhz DDR3 1333 CL6 6-6-18 Hyper PI 32M => 21m 04.959s CPUMARK99 => 385 CrystalMark CINEBENCH (1 CPU) 3199 (X CPU) 11446 PCMark Vantage PCMark Score 10664 Windows7 Processor 7.2 Hyper PI can run quad cores to test stability and performance, but doesn’t support multi-core structure. The actual performance is still little bit slower than single core. The CPUMARK99 is only for single core performance. Other software all support quad cores, so the performance is much better. As multi-core software, Q8400 default 2.66Ghz X 4 is still higher than E6300 OC to 4.2Ghz X 2. OC CPU 466 X 8 =>3728Mhz DDR3 1864 CL8 8-8-22 Hyper PI 32M => 15m 37.749s CPUMARK99 => 538 CrystalMark CINEBENCH (1 CPU) 4480 (X CPU) 15957 PCMark Vantage PCMark Score 12362 Windows7 Processor 7.5

CINEBENCH (1 CPU) 3312 (X CPU) 6297 PCMark Vantage PCMark Score 6827 Windows7 Processor 6.3 OC CPU 400 X 10.5 => 4200Mhz DDR3 1600 CL7 7-7-20 Hyper PI 32M => 13m 17.333s CPUMARK99 => 606 CrystalMark CINEBENCH (1 CPU) 4967 (X CPU) 9500 PCMark Vantage PCMark Score 9726 Windows7 Processor 7.0 After OC, E6300 performance is improved in all benchmark software. If need to reach 4G, you need about 1.376V. It’s better than E5200/5300 R0 stepping. But the voltage is still higher than E5200 M0. Look forward E6300 having better OC to replace E5 series faster. When OC to 4.2G, Windows7 score E6300 at 7.0 Second one is Intel Core 2 Quad 8400 FSB 333Mhz?Clock 2.66Ghz?L2 cache is 4MB?power consumption 95W? It’s Intel entry quad core product, the price is 6000NTD, around 180USD. This model also has energy saving version, 65W?Q8400s?but Q8400s is higher than Q8400 around 30USD. Intel Core 2 Quad 8400 CPU and bundled Cooler As Q8400 is quad core CPU, the thinner Cooler bottom is copper.

It’s been 3 years as Intel launched Core 2 Duo. Core 2 Duo CPU got very good reputation as announcing and Intel launched Core 2 Quad CPU later to pull up the multi-tasking performance. Last year, Intel announced Core i7, has higher performance, for hi-end market. And you will see i5 CPU soon. For the Intel 3 socket structures, LGA775 is the oldest one and for mainstream market. However, the C/P value is still high. Core 2 Duo product line can be divided by frequency and L2 cache. Most hi-end is E8 series, 333 FSB and L2 6MB, then is E7 series, L2 is 3MB, belongs to mid-hi market. The cheaper one is E5 series, 200 FSB and 2MB cache. Power consumption is 65W, Code name is Pentium. Pentium is quite confusing user it’s Pentium4 structure. It’s not so, E5 series is Core 2 Duo, just only cache different. Of course, we cannot forget the most entry E1 series with 512K cache. The code name is Celeron. As it is Core 2 Duo structure, the performance is still good. This time I buy is Intel Pentium Dual-Core E6300 E6300, very familiar ID, is Intel 65nm mid-hi product, and in fact it’s Pentium Dual-Core E6300 to replace E5 series. L2 is 2MB and the FSB is 266MHz, the clock is 2.8GHz. The current price is 2650NTD, around 80USD. Intel Pentium Dual-Core E6300 CPU and bundled Cooler Intel CPU all use thinner cooler after 45nm manufacturing process. CPU is R0 stepping. In the forum, as E5200/E5300 transfered to R0, the OC ability is worse. I hope E6300 can have better performance in R0 stepping. This time I use MB-GIGABYTE GA-EP45T UD3R DDR3 price has been dropping for several months. As the current market price, DDR3 platform becomes much cheaper. SB heatsink shows it supports DDR3. 6 phase PWM, 2oz copper PCB and all Japanese solid capacitors. System configuration CPU: Intel Pentium Dual-Core E6300 MB: GIGABYTE GA-EP45T UD3R DRAM: CORSAIR Dominator 2GBX2 DDR3 1800C8D VGA: MSI N9600GT Diamond HD: Intel X25-M 80GB POWER: Corsair 400W Power Supply Cooler: Thermaltake V1 AX OS is Windows7 64bit Defalut CPU 266 X 10.5 => 2800Mhz DDR3 1066 CL5 5-5-15 Hyper PI 32M => 19m 24.792s CPUMARK99 => 404 CrystalMark

about CPU Intel Core i7 950 D0 OC 200X21=>4203Mhz DDR3 2001 CL9 9-9-24 1T CrystalMark 2004R3 CINEBENCH R10 200/2000 Hyper PI 8 X 32M?HT ON. 181X24=>4349Mhz DDR3 1816 CL8 8-8-24 1T Hyper PI 4 X 32M?HT OFF. There are significant improvement stable under 1.3V when OC to 4000Mhz, 4349Mhz when OC to the limit, pass quad core PI 32M. About 3D: I took a look on the performance of ATI Latest 4650. About the others like 4870x2, 4870, 4850, 9600GT....etc. I match them with the text X8 MSI R4650-MD1G CrossFire 3DMARK2006 3DMARK VANTAGE Crysis Benchmark Need for Speed Undercover 1920X1200 Anti-Aliasing 4X ATI4650 is quite a mid-range VGA. Hope the price of it can be almost the same to 4670, hence, the C/P ratio will be better. The C/P ratio of 4670/ 4830 is still higher than others. FOXCON Quantum Force Flaming Blade conclusion Merits: 1)The packing design is real high quality. And the price is under USD200 too. 2)The options of BIOS are various. Particular the voltage part, OC ability is quite good too. 3)Supports both ATI Crossfire and NV SLI too. Good to gamers all the time. 4)Features with Japanese solid state capacitor. Power/ Reset/ Cmos buttons. 5)Good connectivity: 6 x SATAII, 2 x eSATA, 8 x USB2.0 Drawbacks 1) Foxconn Motherboard is not that easy to be seen in the channel market. 2) no 1394 at this time…. 3) hope there will be a 6 DIMM version for DDR3. Performance ?????????? Components using?????????? Outlook ?????????? C/P ratio ?????????? Most X58 mobos on the market are all around USD200. The Foxconn’s Flaming Blade produce under a OC level design, it’s only in a mid-range price. Further, this is this only X58 I gave a nine star to. If more cheaper X58 motherboards are launched, it will be a good news to i7 users. The most high-end model of Foxconn Quantum Force, the BloodRage priced USD300. Almost the top of the line.. of course the total structure is much better than Flaming Blade; This time, they used 3 DIMM design for a better memory OC performance, but seems users not that appreciated for the special design. The board design should a merit that most users will be agreeing… the red + black design. very sexy. At the beginning, Quantum Force series positioning its products in the highest class of the Foxconn’s product line. But this time Flaming Blade seems make a step down to mid-range price gaming product. The Cost & performance ratio is a key that they considerate now. That is a kind of improvement though. Enthusiast loves to see it. Hope the Quantum Force P55 series will let us surprise with their “cost” and “performance”!

Foxconn software, driver installation page Applications AEGISPANEL Foxconn own-developed software, features overclocking, hardware monitor… functions. You can also FOX LOGO. Users can change the boot-up screens here. about DRAM CORSAIR Dominator 2GBX3 DDR3 1866C9D Official spec is DDR3 1866 CL9 9-9-24 1.65V. DDR3 1871 CL8 8-8-24 1T?1.66V SP2004 3 X Blend mode, 5.64G full loading stable. DDR3 1871 CL8 8-8-24 1T Sandra Memory Bandwidth-32970MB/s EVEREST Memory Read-19525MB/s DDR3 2001 CL9 9-9-24 1T?168V SP2004 3 X Blend mode, 5.83G full loading stable. DDR3 2001 CL9 9-9-24 1T Sandra Memory Bandwidth-34848MB/s EVEREST Memory Read-21056MB/s DDR3 2129 CL9 9-9-24 1T Sandra Memory Bandwidth-36621MB/s EVEREST Memory Read-21460MB/s Flaming Blade is quite strong at DDR3 overclocking, but the only flaw is the voltage at higher end. My ideal voltage is 1.65V with DDR3 2000. The performance score is quite stunning, especially with 6GB DDR3 2129 still could boot up adequately and got into OS. This is a thumbs-up.

Heatsink with style and texture Flaming Blade boot-up screen BIOS page OC setting page CPU Feature DDR3 timing setting page, XMP(Extreme Memory Profile) is there, too. The voltage page CPU Core Voltage +10~1260mV(CPU maximum 2.44750V) CPU VTT Voltage +10~1260mV DRAM Voltage 1.50~2.86V(after 1.60V the interval is 0.01V) CPU Vdroop Compensation, That is a function for CPU to maintain a stability environment when CPU is in a heavy voltage loading status. X58 IOH Core Voltage 1.10~2.36V OC Gear There are 8 storage sections for users to save different settings. Hardware Monitor Above is my settings in Flaming Blade, CPU/DRAM 200/2000 stable. Yet due to CPU, DDR3 may have slightly difference one another, each combination may need still adjustments in the voltage. I spent some time to optimize the setting, for you guys’ reference. Test bed configuration CPU: Intel Core i7 950 MB: FOXCONN Quantum Force Flaming Blade DRAM: CORSAIR Dominator 2GBX3 DDR3 1866C9D VGA: MSI R4650-MD1G CrossFire HD: Intel X25-M 80GB POWER: Corsair HX520W Modular Power Supply Cooler: Megahalems

It’s almost 5 months that Intel launched their Core i7 CPU into market. Almost all the motherboard manufactures are so earnest to make X58 platform for the brand new Core i7 processor. Intel is positioning i7 as a high-end product, consumers think the same too. Before the new mainstream –LGA 1156 with P55 MB coming out, currently it will still be LGA 755 to dominate the Intel CPU’s middle-to-entry level segment market. Foxconn launched an X58 model earlier, named BloodRAGE. Based on current available X58 MBs out there with the price range from USD 200 ~ 300, BloodRAGE is the highest priced one. Therefore, Foxconn’s strategy is to make up their high end product line with lower-priced X58 MBs. This time the man in the spotlight is Foxconn’s latest X58 with a more affordable price under USD200: Quantum Force Flaming Blade. Quite a great bulk for a product package. Every new product comes with a different key image. Foxconn has given mush thoughts to it. Accessories inside. Manual, easy guide, software CD ROM, bridge, IO shield and cables. Flaming Blade in the flash. The components on the MB nicely collocated with color red or black, creates a strong gaming image. MB bottom left 2 X PCI-E X16 ( support 2* 16X ATI CrossFire & Nvidia SLI 2* 16X multi VGA technology) 1 X PCI-E X4 1 X PCI-E X1 2 X PCI Networking chip - Realtek RTL8111C Audio chip - Realtek ALC888?support 7.1 Channel HD MB bottom right 6 X SATAII(ICH10R?suuport Raid 0/1/5/10) 1 X IDE POWER/RESET button?DeBug LED… etc. MB upper right 3 x DIMM DDR3?supports 1333/1600/1800 with up to 12GB. Foxconn adopts a different 3 DIMM design from other X58 MBs, which is exactly what Intel recommended for the most optimized design. 3 DIMM design will get higher performance on basic confirgurations. Beside, it also helps enhance the overclocking capability. MB upper left LGA 1366 CPU socket. Foxconn provides additional LGA775 CPU cooler socket to reduce the hassles of changing between coolers. CPU uses 6 phase PWM, it’s enough for all Core i7 available currently. IO 8 X USB 2.0 2 X Gigabit LAN?supports Teaming Function 2 X eSATA The black button in the center is clear CMOS.

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