[ENG]AMD Latest Llano APU Structure - GIGABYTE A75M-D2H Review

windwithme

Few months ago, AMD launched new product line called APU.

It’s AMD dual core E-350 CPU which integrate GPU and the chipset is Hudson-M1 FCH.

This combo main competitor is Intel Atom platform, and not popular in consumer market.

E-350 CPU performance is similar to Atom, however, its GPU performance is much better than Atom which even better than AMD own IGP performance.

It breaks the trend of IGP performance slow improvement.

In the past, built-in graphic is integrating in Chipset. Since last year, Intel LGA 1155 platform integrated GPU into CPU.

It makes Intel IGP performance catch up AMD platform. This is the first time Intel lead the IGP performance.

AMD IGP is always the leader in the market.

However, each generation 3D performance improvement is small; it causes the UMA market no breakthrough products.

2011, Intel LGA 1156 changed the trend.

Early this year, Intel launched LGA1155 Sandy Bridge, the performance improves 20~30% more. Intel HD2000/3000 performance is leaping.

Finally, AMD launched new Llano APU high performance IGP structure which is the key role this review.

Llano APU chipset has A75 and A55. So far you only can find A75 products in Taiwan.

First of all, let’s see GIGABYTE A75M-D2H package. It is white background and feature and technology logos.

GIGABYTE recently promotes SUPER 4 in entry products. At the first sight, I thought it’s new Japanese Super Sentai series...

GIGABYTE A75M-D2H

SUPER 4 are Super Safe, Super Speed, Super Savings, and Super Sound.

If you are interested in, you can search internet to compare with other brands A75 MB.

This year, GIGABYTE mid to high end MB is black PCB design.

Personally, I prefer water blue or sky blue color. A75M-D2H color tone is pretty good.

It’s Micro ATX and size is 24.4 cmx 22.5 cm.

Bundle Accessories

Product manual, quick installation guide, I/O panel, SATA cables and Driver CD.

Lower-Left Corner

2 X PCI-E X16, first one is X16 and second one is X4 which support AMD CrossFireX technology

1 X PCI-E X1

1 X PCI

Realtek ALC889 audio chip supports 7.1 channel and High Definition Audio technology.

Realtek RTL8111E LAN chip and TPM module connector in black.

Lower-Right Corner

6 X Blue SATA provided by A75. It’s SATA3 and supports RAID 0, RAID 1, RAID 10, JBOD.

Left side has USB 2.0/3.0 front panel connector and right side is DualBIOS.

Upper-Right Corner

2 X DIMM DDR3 supports 1066/1333/1600/1866/2400(OC) and DDR3 max capacity is 32GB.

Next is 24-PIN power connector.

Upper-Left Corner

AMD new Socket FM1 latch is different with AM2+/AM3, but the cooler is common in use.

It’s 4+1 phase PWM. One phase can supply 30~40W, it’s really enough design.

Upper-Left is 4-pin power input.

IO

1 X PS2 KB/MS

D-SUB/DVI/HDMI Output

1 X S/PDIF Fiber Output

4 X USB 2.0(Red)

2 X USB 3.0(Blue)

1 X RJ-45 LAN

windwithme

Few months ago, AMD launched new product line called APU.

It’s AMD dual core E-350 CPU which integrate GPU and the chipset is Hudson-M1 FCH.

This combo main competitor is Intel Atom platform, and not popular in consumer market.

E-350 CPU performance is similar to Atom, however, its GPU performance is much better than Atom which even better than AMD own IGP performance.

It breaks the trend of IGP performance slow improvement.

In the past, built-in graphic is integrating in Chipset. Since last year, Intel LGA 1155 platform integrated GPU into CPU.

It makes Intel IGP performance catch up AMD platform. This is the first time Intel lead the IGP performance.

AMD IGP is always the leader in the market.

However, each generation 3D performance improvement is small; it causes the UMA market no breakthrough products.

2011, Intel LGA 1156 changed the trend.

Early this year, Intel launched LGA1155 Sandy Bridge, the performance improves 20~30% more. Intel HD2000/3000 performance is leaping.

Finally, AMD launched new Llano APU high performance IGP structure which is the key role this review.

Llano APU chipset has A75 and A55. So far you only can find A75 products in Taiwan.

First of all, let’s see GIGABYTE A75M-D2H package. It is white background and feature and technology logos.

GIGABYTE recently promotes SUPER 4 in entry products. At the first sight, I thought it’s new Japanese Super Sentai series...

GIGABYTE A75M-D2H

SUPER 4 are Super Safe, Super Speed, Super Savings, and Super Sound.

If you are interested in, you can search internet to compare with other brands A75 MB.

This year, GIGABYTE mid to high end MB is black PCB design.

Personally, I prefer water blue or sky blue color. A75M-D2H color tone is pretty good.

It’s Micro ATX and size is 24.4 cmx 22.5 cm.

Bundle Accessories

Product manual, quick installation guide, I/O panel, SATA cables and Driver CD.

Lower-Left Corner

2 X PCI-E X16, first one is X16 and second one is X4 which support AMD CrossFireX technology

1 X PCI-E X1

1 X PCI

Realtek ALC889 audio chip supports 7.1 channel and High Definition Audio technology.

Realtek RTL8111E LAN chip and TPM module connector in black.

Lower-Right Corner

6 X Blue SATA provided by A75. It’s SATA3 and supports RAID 0, RAID 1, RAID 10, JBOD.

Left side has USB 2.0/3.0 front panel connector and right side is DualBIOS.

Upper-Right Corner

2 X DIMM DDR3 supports 1066/1333/1600/1866/2400(OC) and DDR3 max capacity is 32GB.

Next is 24-PIN power connector.

Upper-Left Corner

AMD new Socket FM1 latch is different with AM2+/AM3, but the cooler is common in use.

It’s 4+1 phase PWM. One phase can supply 30~40W, it’s really enough design.

Upper-Left is 4-pin power input.

IO

1 X PS2 KB/MS

D-SUB/DVI/HDMI Output

1 X S/PDIF Fiber Output

4 X USB 2.0(Red)

2 X USB 3.0(Blue)

1 X RJ-45 LAN

windwithme

Even though AMD A75 chipset is mid end range, if MOSFET has heat sink will be better.

A75 chipset heat sink is new design this year and the matte handle quality is good.

A75M-D2H use Realtek ALC889 audio chip and GIGABYTE emphasize it’s 108dB SNR, Signal-to-Noise Ratio.

If I get time, I will test it with other MBs ALC889 by high end speakers or headset to compare the difference.

BIOS M.I.T. Menu

Voltage Range

DDR3 Voltage Control 1.025~1800V

CPU VDDP Voltage Control 0.900~1.480V

CPU Vcore 0.750~1.795V

CPU NB VID Control -0.600~+0.300V

CPU Voltage Control -0.600~+0.400V

Memory Clock

AM3 platform can support up to DDR3 1600. FM1 socket can pull clock to DDR3 1866.

IGX Setup Items

You can set share memory as 256, 512 or 1024MB.

Dual-link DVI enable item can support highest resolution to 2560 x 1600.

VGA Core Clock can adjust GPU clock. However, APU 3D performance is not pulling by this item.

Advanced DDR3 Parameters Setup

CORSAIR XMS 8GB DDR3 1600 CL9 OC to 1866 CL8

CPU related items, you can enter IGX setup page from here.

PC Health Status

BIOS items are similar with AM2+/AM3. If you used to use previous AMD platform, it won’t be problem to you.

A75M-D2H provides plenty items for users to fine tune.

Test Configuration

CPU: AMD A8-3850

MB: GIGABYTE A75M-D2H

DRAM: CORSAIR CMX8GX3M2A1600C9

VGA: AMD Radeon HD6550D

HD: CORSAIR Performance 3 Series P3-256 SSD

POWER: Thermaltake TR2 450W

Cooler: Thermaltake Jing

OS: Windows7 Ultimate 64bit SP1

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CPU is AMD latest A8-3850. There is another model, A6-3650, in the market. It’s also Llano APU structure.

The core name is Llano, 32nm, TDP 100W, clock 2.90GHz and 4MB L2 Cache.

In L2 cache, it’s higher than Phenom II 2MB, but it’s no L3 cache.

Performance Test

CPU 100.0 X 29 => 2900.1MHz

DDR3 1866.8 CL8 10-8-27 1T

GPU 600MHz

Hyper PI 32M X 4 => 22m 43.084s

CPUMARK 99 => 453

Nuclearus Multi Core => 12559

Fritz Chess Benchmark => 15.08/7240

CrystalMark 2004R3 => 204026

CINEBENCH R11.5

CPU => 3.46 pts

CPU(Single Core) => 0.88 pts

PCMark Vantage => 12276

Windows Experience Index - CPU 7.3

A8-3850 double L2 cache and no L3 cache compare to Phenom II. The performance is similar.

Even though phase in 32nm is exciting for AMD fans. However, they might be upset for same performance.

I do hope Bulldozer 8Core CPU can show users the leap improvement.

DRAM Bandwidth

DDR3 1333.4 CL6 6-6-18 1T

ADIA64 Memory Read - 8088 MB/s

Sandra Memory Bandwidth - 12640 MB/s

MaXXMEM Memory-Copy -9455 MB/s

DDR3 1600.2 CL7 8-7-24 1T

ADIA64 Memory Read - 9229 MB/s

Sandra Memory Bandwidth - 15266 MB/s

MaXXMEM Memory-Copy - 10655 MB/s

DDR3 1866.8 CL8 10-8-27 1T

ADIA64 Memory Read - 9556 MB/s

Sandra Memory Bandwidth - 16192 MB/s

MaXXMEM Memory-Copy - 10979 MB/s

FM1 DDR3 spec is 1.50V. CPU in default clock, memory can reach DDR3 1866 which is improved.

You can see the performance improve most from DDR3 1333 to 1600. From 1600 to 1866, the improvement is much less.

For DRAM bandwidth, it’s weak point for AMD for many years. They should try to solve this issue soon…

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Temperature(It’s 32? in room. All temperature is showed by ? in the test below.)

Enter to OS Desktop - 34

CPU Full Speed - 65

Intel Burn Test v2.4?Stress Level Maximum

For temperature, ADIA64 score is much lower and Core Temp only can test single core.

So I pick ADIA64 and Easy Tune6 for standard. Personally, I feel Easy Tune6 is close to real temperature.

Comparing to Athlon II or Phenom II I used to test, the temperature didn’t drop much as 32nm.

It might causes by CPU integrated GPU. I hope the future yield rate can improve this issue.

Power Consumption Test

Enter to OS Desktop - 32W

CPU Full Speed - 146W

Intel Burn Test v2.4?Stress Level Maximum

CPU and GPU Full Speed - 171W

OCCT Power Supply Test

BIOS enable Cool&Quiet technology and just enter to OS desktop, the temperature is very good.

CPU full speed, it increases to 113W, and CPU/GPU full speed up to 134W. You can see GPU effect 26W.

The main power consumption of whole system is CPU. Built-in GPU is not high as Desktop system.

A75 chipset native support SATA3. SATA transfer rate is another key for AMD platform.

I use CORSAIR Performance 3 Series, supports SATA3, for higher SSD performance.

Model is P3-256. The size is common 2.5”. Capacity is 256GB and weight is 80 grams.

Official spec, max reading is 480 MB/s and writing is 320 MB/s. (Test by ATTO Disk Benchmark)

Silver shell and MTBF 150000 hours. 3 years warranty.

ATTO DISK Benchmark over 32k test is very close to max performance. The reading is 482.5 Mb/s and writing is 328.2 MB/s.

File Benchmark over 512k test the writing is over 300 MB/s.

AS SSD Benchmark

Seq Read - 438.20 MB/s Write - 288.70 MB/s

CrystalDiskMark reading is 444.8 Mb/s and writing is 313.9 MB/s

A75 SATA3 transfer rate is over standard. ATTO max Read/Write can achieve 438/328 MB/s.

In other benchmark software, the scores are not far from official spec. You can see AMD chipset great leap in this part.

It supports 6 SATA3 ports. It’s good for more and more SATA3 HDD or SSD products in the markret.

AMD Radeon HD6550D Performance Test

Default Clock 600MHz

3DMark Vantage => P4450

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StreetFighter IV Benchmark

1280 X 720 => 98.62 FPS

FINAL FANTASY XIV

1280 X 720 => 1818

LOST PLANET 2

DX9C 1280 X 720 TEST B - 10.3 fps

A8-3850 built-in Radeon HD6550D and A6-3650 built-in Radeon HD6530D. The spec and performance is a little different.

The test is higher level HD 6550D. 3D performance is close to entry level VGA card. This is impressive part for Llano APU.

Game Benchmark is 3~4 times more than pervious 890GX. You can see the advantage for GPU leading company here.

As Llano APU 3D performance, it’s decided by DDR3 clock and CPU FSB.

If you set DDR3 at default 1066, 3DVANTAGE is about P3000.

Comparing to DDR3 1866, 3DVANTAGE increase about 50%.

Of course, APU 3D limitation is not only this. If you OC CPU FSB and higher DDR3 clock, it can be over P6000.

GIGABYTE A75M-D2H

Good

1. 100% Japanese made solid caps, USB 3x power design and On/Off Charge practical features.

2. Rich BIOS items for complete CPU/GPU/DDR3 OC requirement.

3. APU latest IGP technology. Most high end HD 6550D 3D performance is leaping.

4. Native 6 SATA3 and 2 USB 3.0. Also support 2 front USB 3.0 devices.

5. AMD Dual Graphics and Dual-link DVI is good for Gaming or multimedia.

Weakness

1. CPU PWM has no heat sink.

2. 4 DIMM DDR3 will be better

2. AMD 3850/3650 + A75 MB price is too high currently

Performance ??????????

Components ??????????

Specification ??????????

Outlook ??????????

C/P Value ??????????

A8-3850 is 32nm which has been waiting for long time by AMD fans.

3D IGP performance is leaping and A75 also supports USB 3.0 and SATA3. It enhances AMD advantages in market competition.

However, for CPU performance, power consumption and temperature is same after moving to 32nm.

Also DDR3 bandwidth hasn’t been improved for years. AMD should improve these points soon.

Maybe, the future 8 Cores CPU, Bulldozer, performance will be better.

Llano APU built-in 3D performance is very impressive.

It’s may stimulated by Intel which focus on IGP performance improvement in these 2 years.

AMD(ATI) is one of the two GPU leading manufacturer. However, this time they cannot care entry VGA market profit this time.

After merging ATI, AMD must improve IGP performance to lead in 3D field.

OF course, you won’t disappoint the AMD GPU. HD6550D win back the IGP leading position again.

As previous AMD is for mid to low end market, Llano APU price is higher.

If you think it’s X4 955 and entry level VGA, APU platform is cheaper actually.

As AMD just launched Llano APU structure in early July, it’s only A75 chipset now. It will have A55 chipset later.

CPU is only A8-3800 and A6-3600. If A6-3600 plus A55 MB, the cost performance will be enhanced.

Intel Sandy Bridge fires the IGP war, and AMD Llano APU hold the leading positon.

Even though they both launched only high end product in the beginning, as new structure be more popular, you will see more mid to entry products.

According to 2011 IGP performance war, I believe users are the final winners.

You can get better performance system with lower price.

This article is also post in my own blog WIND3C Welcome your visit.

keroro.90

Fantastic job....!

tom1

well done , always