Big step to the future, GIGABYTE EX58 EXTREME with Intel I7 EXTREME 965 CPU
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In my image, it’s been over 2 years as Intel launched Core 2 Duo CPU in LGA 775. After then,
Intel announced several Core 2 Quad CPUs to combine with Intel LGA775 chipset.
In the past 2 years, 965/975, P35/X38 and latest P45/X48 are all successful products.
However, Intel is not satisfied with this, in Nov 2008, complete new structure LGA1366 I7 series is launching.
Of course, all MB manufacturers have new boards to support LGA 1366.
One of the largest MB providers, GIGABYTE, also provides 3 models, EX58-UD5, EX58-UD5P and EX58-EXTREME as internet info.
The one on my hand is most hi-end one, EX58-EXTREME.
EXTREME is the new series that GIGABYTE started in 2008.
It’s for most hardcore overclockers and enthusiasts.
GIGABYTE has had 2 EXTREME with P45. This time, they also launch EXTREME with X58.
GIGABYTE EX58-EXTREME board
SB highlights Ultra Durable3, which is the most hi-end components usage from GIGABYTE
100% Japanese made solid capacitors + 2 oz copper PCB. Components quality is always the GIGABYTE strength.
Left Lower Corner
2 X PCI-E X16
2 X PCI-E X8(These 3 PCI-E support 3-Way SLI/CrossFireX)
1 X PCIE X4
1 X PCIE X1
2 X PCI
Realtek 8111D is LAN chip that supports Teaming technology
Realtek ALC889A, supports 7.1 channels and High Definition Audio. It also supports Dolby sounds by only 2 channels speakers.
PCB is MADE IN TAIWAN
Right Lower Corner
6 X SATAII(by SB ICH10R)
4 X SATAII
1 X IDE
Dual BIOS
Diagnostic LED
Right Upper Corner
6 X DIMM DDR3, support 800/1066/1333/1867/2133/2400, above 2133 are special spec.
X58 another big change is 3-channel DDR3. The performance is highly expected by end users.
DRAM part has extra 2-phase PWM. 24Pin power connector is nearby.
POWER/RESET buttons
The retail version DDR3 DIMM slots are changed to Blue and White. That makes the board color be matched.
Also provides LED to show the DES status. Users can know the DES status by lights.
CPU VRM is 6+6 phases designed and of course support DES advanced energy saving technology.
Latest VRD11.1 designed can support better power saving features with Intel new stepping CPU.
IO Shield
8 X USB 2.0
2 X RJ-45 LAN
1 X S/PDIF
1 X 1394
Clear COMS button
EX58-EXTREME thermal module
The surface use special process which without Oxidation problem. The black coated surface also looks more stylish.
Dynamic 6+6 phases PWM + Lower RDS MOSFET
The heat sink glistens with colors.
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In my image, it’s been over 2 years as Intel launched Core 2 Duo CPU in LGA 775. After then,
Intel announced several Core 2 Quad CPUs to combine with Intel LGA775 chipset.
In the past 2 years, 965/975, P35/X38 and latest P45/X48 are all successful products.
However, Intel is not satisfied with this, in Nov 2008, complete new structure LGA1366 I7 series is launching.
Of course, all MB manufacturers have new boards to support LGA 1366.
One of the largest MB providers, GIGABYTE, also provides 3 models, EX58-UD5, EX58-UD5P and EX58-EXTREME as internet info.
The one on my hand is most hi-end one, EX58-EXTREME.
EXTREME is the new series that GIGABYTE started in 2008.
It’s for most hardcore overclockers and enthusiasts.
GIGABYTE has had 2 EXTREME with P45. This time, they also launch EXTREME with X58.
GIGABYTE EX58-EXTREME board
SB highlights Ultra Durable3, which is the most hi-end components usage from GIGABYTE
100% Japanese made solid capacitors + 2 oz copper PCB. Components quality is always the GIGABYTE strength.
Left Lower Corner
2 X PCI-E X16
2 X PCI-E X8(These 3 PCI-E support 3-Way SLI/CrossFireX)
1 X PCIE X4
1 X PCIE X1
2 X PCI
Realtek 8111D is LAN chip that supports Teaming technology
Realtek ALC889A, supports 7.1 channels and High Definition Audio. It also supports Dolby sounds by only 2 channels speakers.
PCB is MADE IN TAIWAN
Right Lower Corner
6 X SATAII(by SB ICH10R)
4 X SATAII
1 X IDE
Dual BIOS
Diagnostic LED
Right Upper Corner
6 X DIMM DDR3, support 800/1066/1333/1867/2133/2400, above 2133 are special spec.
X58 another big change is 3-channel DDR3. The performance is highly expected by end users.
DRAM part has extra 2-phase PWM. 24Pin power connector is nearby.
POWER/RESET buttons
The retail version DDR3 DIMM slots are changed to Blue and White. That makes the board color be matched.
Also provides LED to show the DES status. Users can know the DES status by lights.
CPU VRM is 6+6 phases designed and of course support DES advanced energy saving technology.
Latest VRD11.1 designed can support better power saving features with Intel new stepping CPU.
IO Shield
8 X USB 2.0
2 X RJ-45 LAN
1 X S/PDIF
1 X 1394
Clear COMS button
EX58-EXTREME thermal module
The surface use special process which without Oxidation problem. The black coated surface also looks more stylish.
Dynamic 6+6 phases PWM + Lower RDS MOSFET
The heat sink glistens with colors.
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SB ICH10R collocate with big heat sink which can lower the heat
EXTREME Hybird SLENT-PIPE2 is not same as P45 EXTREME copper one
Dual VGA or 3 VGA bridge. NV SLI and ATI CFX all supported
EX58-EXTREME installs Hybird SLENT-PIPE2
3-Channel DDR3 is key structure of X58
CORSAIR AIRFLOW can support 3DIMM Memory cooling
Thermaltake V1 AX also support LGA 1366 CPU
Boot Screen
Main page
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M.I.T. Frequency and Voltage setup page
CPU Feature
UnCore/QPI Feature
QPI Link Speed is must item for lift frequency
Clock Control
INTEL exclusive Memory OC technology
If DDR3 SPD supports XMP, BIOS will show this item. Users can OC very easily.
Advanced DRAM setting
Advanced voltage page
CPU Vcore 0.5000~1.90000V
QPI/VTT Voltage 1.082~2.000V
CPU PLL 1.400~2.500V
QPI PLL 0.800~1.600V
IOH Core 1.000~2.000V
ICH I/O 1.050~2.500V
DARM Voltage 1.300~2.600V
DRAM Termination 0.520~1.225V
PC Health Status
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System Configuration
CPU: INTEL Core I7 EXTREME 965
MB: GIGABYTE EX58-EXTREME
DRAM: CORSAIR Dominator 1GBX3 1800C7DIN/2GBX3 1600C8D
VGA: MSI R4870X2-T2D2G-OC
HD: SAMSUNG 32GB SSD SLC
POWER: Corsair HX1000W Modular Power Supply
Cooler: Thermaltake V1 AX/JETART Nano Diamond
GIGABYTE EasyTune6 is a rich feature utility.
Quick Boost is the new feature in X58 EXTREME.
CPU
Memory
VGA
HW Monitor
Similar to CPU-Z/GPU-Z can display hardware info. It also can monitor the voltage and temperature status. You also can adjust all clock and voltage in this integrated software.
CPU part
INTEL Core I7 EXTREME 965 which is Quad core and support HT liked technology, so it shows 8 cores.
CPU: 3497Mhz
DRAM: DDR3 1618 CL8 8-8-24 1T 1.64V XMP
4 X SUPER PI 32M
CPU: 3870Mhz
DRAM: DDR3 1618 CL8 8-8-24 1T 1.64V
CrystalMark
CINEBENCH R10
PCMARK2005
PCMARK seems not support 4870X2. The VGA performance is more like single card. But in the other parts, all performance are better than LGA775 especially Memory.
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133Mhz OC 200Mhz SUPER PI 1M/CPUMARK
LGA 1366 changes to QPI from FSB and the frequency is only 133Mhz. However, the performance is no any decline to LGA 775.
Memory part
1GBX3
Triple channel
DDR3 1888 CL8 8-8-21,20435MB/s
DDR3 1987 CL8 8-8-21,21357MB/s
In Triple channel mode, the performance is extremely high. It’s almost double the previous DDR2/DDR3 platforms.
Thus it can be seen LGA 1366 takes DDR3 performance into the new generation.
Dual channel
DDR3 2000 CL8 7-6-21,21685MB/s
DDR3 1987 CL7 6-5-21,21967MB/s
CPU-Z always shows 1 or 2 more in CL value, so I use EVEREST as standard. Besides, the dual channel performance is also great. But in the same clock and CL, Triple channel is still higher.
2GBX3 CORSAIR CM3X2G 1600C8D
EVERSET&SANDRA
DDR3 1619 CL8 8-8-24 1T 1.6V
Single channel
12575/11906MB/s
Dual channel
18383/21002MB/s
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Triple channel
18900/28754MB/s
OC DDR3 1836 CL8 8-8-24 1T 1.6V
19853/32866MB/s
You can see obviously under LGA 1366 structure, 3GB bandwidth is higher than 2GB around 7752MB/s in SANDRA.
3DMark
MSI 4870X2 780/1800Mhz
3DMARK2005
3DMARK2006
These 2 results are surprising me. I use the same 4870X2 but the performance is 10~20% higher than LGA775 platform. This is very great performance improvement which only changed platform.
Concludes GIGABYTE EX58-EXTREME
Good
1.EXTREME series has GIGABYTE UD3 components and rich features
2.100% Japanese made solid capacitors, extra 2-phase PWM for NB and Memory
3.BIOS is also improved a lot. It provides wide voltage range and rich BIOS parameters are never seen in GIGABYTE products before.
4.10 SATAII, Dual LAN, 6xDIMM DDR3
5.Diagnostic LED and Power/Reset/Clear CMOS buttons
6.3-channel DDR3 performance and 3-Way SLI/CFX supported
7.6+6 Dynamic PWM, Intel latest VRD11.1 design, Exclusive DES Advanced for efficient power control.
8.EasyTune6 provides plenty features in OS.
Weak
1.LGA 1366 platform is too costive at the moment.
2.I7 CPU max power consumption is 130W, a little bit too high
3.If GIGABYTE can provide audio module card that will be better
Performance ??????????
Components ??????????
Outlook ??????????
C/P ??????????
GIGABYTE is good at using better quality components with the same selling price.
EXTREME series is the product has both performance and OC capability.
So it’s absolutely the most hi-end product in GIGABYTE line.
2oz copper, DES, 50000hrs Japanese made solid capacitors, dynamic PWM, and Hybird SLENT-PIPE2 combination, all features are very impressive.
DDR3 performance and OC capability are much better than P45 under this new structure. The market price and BIOS update OC ability will be the key for X58.
One more important factor is X58 is NV SLI/ATI CFX combo. This is the dream for many 3D performance seekers. X58 makes this dream come true.
This time, Intel’s changed is really impressive for the performance and specifications.
The product key selling factor is always price. In the near future, we can see LGA1366 replacing LGA775 as hi-end product leader.
However, what budget you have, what product you get.
The best C/P is always key concern. If you are going to build a new PC and have very high budget, LGA1366 is your must consideration.
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i reaaly love your review windwithme
impressive bandwidth in triple channel!
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fantastic review and very good performance for these nehalems
even if oc capability are not so impressive
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