<?xml version="1.0" encoding="UTF-8"?><rss xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:content="http://purl.org/rss/1.0/modules/content/" xmlns:atom="http://www.w3.org/2005/Atom" version="2.0"><channel><title><![CDATA[IDP presenta il case SPEDO Advance Package di Thermaltake]]></title><description><![CDATA[<p><img src="http://www.xtremehardware.com/images/stories/News/casett.gif" alt="casett.gif" /></p>
<p><em><em><span style="font-family:Verdana"><span style="font-family:Verdana">Il nuovo full  tower di Thermaltake punta verso l’innovazione tecnologica con un avanzato  design e due sistemi brevettati per garantire un’ottima performance  termica.</span></span></em></em></p>
<p> <em><em><span style="font-family:Verdana"><span style="font-family:Verdana"> </span></span></em></em></p>
<p> <em><em><span style="font-family:Verdana"><span style="font-family:Verdana">Legnano  (MI), Settembre 2008</span></span></em></em><span style="font-family:Verdana"><span style="font-family:Verdana"> – </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>IDP</strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana">, distributore italiano di hardware di  alta qualità, presenta il case SPEDO di Thermaltake. La casa taiwanese ha  brevettato il design di questo nuovo full tower inserendo </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>due innovativi sistemi integrati </strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana">per  offrire un efficace sistema di raffreddamento e circolazione dell’aria,  un’intelligente gestione dei cavi e un’elevata  versatilità.</span></span></p>
<p> <span style="font-family:Verdana"><span style="font-family:Verdana">Il  cuore innovativo di </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>SPEDO Advance  Package</strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana"> si trova al suo interno, grazie alle due soluzioni che  offrono un perfetto sistema di aerazione: </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>“A.T.C.3”</strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong><em><em> (Advanced Thermal Chamber 3)</em></em></strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana">, e </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>“C.R.M.3” </strong></strong></span></span></span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong><em><em>(Cable Routing Management  3).</em></em></strong></strong></span></span></span></span></p>
<p> <span style="font-family:Verdana"><span style="font-family:Verdana">Continua  sul comunicato stampa allegato.</span></span></p>
<p><a href="http://www.xtremehardware.com/index.php?option=com_content&amp;view=article&amp;id=1854&amp;Itemid=73"><img src="http://www.xtremehardware.com/forum/images/readmore.gif" alt="readmore.gif" /></a></p>
]]></description><link>https://www.xtremehardware.com/forum//topic/8112/idp-presenta-il-case-spedo-advance-package-di-thermaltake</link><generator>RSS for Node</generator><lastBuildDate>Tue, 19 May 2026 00:56:35 GMT</lastBuildDate><atom:link href="https://www.xtremehardware.com/forum//topic/8112.rss" rel="self" type="application/rss+xml"/><pubDate>Mon, 15 Sep 2008 06:08:00 GMT</pubDate><ttl>60</ttl><item><title><![CDATA[Reply to IDP presenta il case SPEDO Advance Package di Thermaltake on Mon, 15 Sep 2008 06:08:00 GMT]]></title><description><![CDATA[<p><img src="http://www.xtremehardware.com/images/stories/News/casett.gif" alt="casett.gif" /></p>
<p><em><em><span style="font-family:Verdana"><span style="font-family:Verdana">Il nuovo full  tower di Thermaltake punta verso l’innovazione tecnologica con un avanzato  design e due sistemi brevettati per garantire un’ottima performance  termica.</span></span></em></em></p>
<p> <em><em><span style="font-family:Verdana"><span style="font-family:Verdana"> </span></span></em></em></p>
<p> <em><em><span style="font-family:Verdana"><span style="font-family:Verdana">Legnano  (MI), Settembre 2008</span></span></em></em><span style="font-family:Verdana"><span style="font-family:Verdana"> – </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>IDP</strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana">, distributore italiano di hardware di  alta qualità, presenta il case SPEDO di Thermaltake. La casa taiwanese ha  brevettato il design di questo nuovo full tower inserendo </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>due innovativi sistemi integrati </strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana">per  offrire un efficace sistema di raffreddamento e circolazione dell’aria,  un’intelligente gestione dei cavi e un’elevata  versatilità.</span></span></p>
<p> <span style="font-family:Verdana"><span style="font-family:Verdana">Il  cuore innovativo di </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>SPEDO Advance  Package</strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana"> si trova al suo interno, grazie alle due soluzioni che  offrono un perfetto sistema di aerazione: </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>“A.T.C.3”</strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong><em><em> (Advanced Thermal Chamber 3)</em></em></strong></strong></span></span><span style="font-family:Verdana"><span style="font-family:Verdana">, e </span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong>“C.R.M.3” </strong></strong></span></span></span></span><span style="font-family:Verdana"><span style="font-family:Verdana"><span style="font-family:Verdana"><span style="font-family:Verdana"><strong><strong><em><em>(Cable Routing Management  3).</em></em></strong></strong></span></span></span></span></p>
<p> <span style="font-family:Verdana"><span style="font-family:Verdana">Continua  sul comunicato stampa allegato.</span></span></p>
<p><a href="http://www.xtremehardware.com/index.php?option=com_content&amp;view=article&amp;id=1854&amp;Itemid=73"><img src="http://www.xtremehardware.com/forum/images/readmore.gif" alt="readmore.gif" /></a></p>
]]></description><link>https://www.xtremehardware.com/forum//post/136661</link><guid isPermaLink="true">https://www.xtremehardware.com/forum//post/136661</guid><dc:creator><![CDATA[Redazione di XtremeHardwar]]></dc:creator><pubDate>Mon, 15 Sep 2008 06:08:00 GMT</pubDate></item></channel></rss>